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Intel Sparks Industry Buzz with Breakthrough Test Chips Using Next-Gen Process

Deepika Rana / Updated: Apr 30, 2025, 06:40 IST
Intel Sparks Industry Buzz with Breakthrough Test Chips Using Next-Gen Process

Intel is making waves across the semiconductor industry as it showcases promising results from test chips built on its newest manufacturing process node, a move seen as a key milestone in its aggressive strategy to reclaim technological leadership from Asian foundry rivals.

Sources close to the matter report that several major tech firms — including cloud service providers and advanced computing companies — have expressed strong interest in Intel's early silicon samples, which were produced using the company’s latest process technology, widely believed to be Intel 18A (angstrom). The 18A node is expected to usher in a new era of performance and efficiency gains, driven by breakthroughs such as RibbonFET transistors and PowerVia backside power delivery.

Intel has been testing the new node internally as part of its “five nodes in four years” roadmap — a high-stakes campaign launched by CEO Pat Gelsinger to position Intel Foundry Services (IFS) as a global competitor to Taiwan Semiconductor Manufacturing Company (TSMC) and Samsung.

According to industry analysts, the successful fabrication of these test chips signals that Intel is on track with its development timeline, with risk production for 18A expected to transition into volume production by late 2025.

"There’s been skepticism around Intel's ability to execute at the pace it promised, but these test chips represent tangible proof that the company is making real progress," said Daniel Li, a senior analyst at Semiconductor Strategy Group. "The performance metrics we're hearing from early evaluations are very competitive."

Intel has not disclosed which companies are evaluating the chips, but insiders suggest that several high-profile partners — including potential fabless customers — are involved in early testing. The interest reflects a growing appetite for alternatives to TSMC, especially among Western tech firms looking to diversify their chip supply chain in the face of geopolitical uncertainty.

The U.S. government has also taken notice. As part of the CHIPS and Science Act incentives, Intel’s development of advanced process technologies is viewed as critical to bolstering domestic semiconductor capabilities and reducing reliance on overseas fabs.

In a recent media statement, Intel confirmed that customer engagement for 18A is growing and reiterated that the process remains on schedule. “We are seeing strong momentum with our leading-edge nodes, and customer feedback on test chips has been very encouraging,” said Ann Kelleher, head of Intel’s Technology Development.

The 18A node is slated to power both Intel's own future processors and chips built for external clients under the IFS banner. If successful, it could mark a significant inflection point in Intel’s foundry ambitions — and a challenge to the dominance of long-reigning Asian manufacturers.

For now, the semiconductor world will be watching closely to see whether Intel can turn promising prototypes into mass production success.